Bambu Lab PC

 

PC (Polycarbonate) filament is a strong and durable material known for its high heat resistance, impact resistance, and optical clarity. It is commonly used in applications that require toughness and stability, such as functional prototypes, automotive components, electronic enclosures, and engineering parts.

Bambu Lab PC filament is designed to deliver consistent and reliable printing performance. It provides excellent layer adhesion, ensuring strong and reliable prints. PC filament typically requires higher printing temperatures and a heated print bed to prevent warping and promote adhesion.

Recommended Printing Settings

Drying Settings before Printing	80 °C, 8 h
Printing and Keeping Container's Humidity	< 20% RH (Sealed, with Desiccant)
Nozzle Temperature	260 - 280 °C
Bed Temperature (with PVP Glue)	90 - 110 °C
Printing Speed	< 300 mm/s

Physical Properties

	Density	1.20 g/cm³
	Vicat Softening Temperature	119 °C
	Heat Deflection Temperature	117 °C
	Melting Temperature	228 °C
	Melt Index	32.2 ± 2.9 g/10 min

Mechanical Properties

Tensile Strength	62 ± 2 MPa
Breaking Elongation Rate	3.8 ± 0.3 %
Bending Modulus	2310 ± 70 MPa
Bending Strength	108 ± 4 MPa
Impact Strength	34.8 ± 2.1 kJ/m²

Smart Printing with RFID

With Bambu PC, all the essential printing parameters are conveniently embedded in an RFID chip. This RFID chip can be read by our AMS (Automatic Material System), eliminating the need for manual configuration and tedious setup steps.

Simply load the filament onto the printer, and the AMS will automatically detect the material and retrieve the corresponding printing parameters from the RFID chip. This streamlined process saves you time and effort, allowing you to start printing right away without the hassle of adjusting settings.

Say goodbye to manual parameter input and enjoy a more seamless and efficient printing experience with Bambu PC and our integrated AMS technology.

 

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